Photo: barchart.com
Teledyne Chooses onsemi's Treo Platform for Cutting-Edge Infrared Imaging ASICs
Teledyne Technologies has chosen onsemis Treo platform to innovate next-generation infrared imaging ASICs, marking a significant advancement in semiconductor device fabrication.
- Teledyne Technologies selected onsemis Treo platform on October 28, 2025, to enhance infrared imaging systems with advanced readout integrated circuit (ROIC) application-specific integrated circuits (ASICs).
- The Treo platform is recognized as the industrys most advanced analog and mixed-signal platform, facilitating superior performance in semiconductor device fabrication for infrared applications.
- This collaboration aims to leverage analog signal processing to develop cutting-edge technologies that improve the functionality and efficiency of infrared imaging systems.
Por Qué Es Relevante
This partnership between Teledyne Technologies and onsemi highlights the ongoing innovation in infrared imaging technology, which is crucial for applications across defense, automotive, and healthcare sectors. The advancement in semiconductor device fabrication can potentially lead to enhanced imaging capabilities and new market opportunities.